Thick Film, Hybrid and Printed Interconnect technologies

Biotron Industries Limited has at its core almost 30 years experience in the design and manufacture of substrates, components and modules using well proven Thick Film printed circuit manufacturing technologies. The company offers many Multi-layer Interconnect Options - Resistor Networks, Thick Film Hybrids, Multi-Chip Modules, Wire Bonding, Chip on Board, Surface Mount Assembly, PCB Assembly, Mixed Technology & Turn Key Services.

Additional capabilites include passive and active laser trimming, printed through holes in ceramic, thick film heaters on ceramic and stainless steel, thick film copper, patterning and resistor printing on Aluminium Nitride, fineline interconnect, conformal and epoxy coating, SIL and DIL lead attach, fully RoHS compliant product and customised anti-static packaging.

Biotron offers fast design and production of prototypes. Our self-contained factory allows us to offer complete flexibility in design & production. In-house manufacture of print screens/stencils allows Biotron to offer leadtimes for prototypes comparable with that available in the PCB Industry. Our efficient and highly skilled workforce coupled with significant automation and a lean approach to manufacturing makes our products and services some of the most competitive available. In many cases, total cost of ownership can be equal to or lower than that of PCB. Also, in applications where PCB simply cannot provide the robustness, thermal capacity or efficiency required, Thick Film can often provide the only technical solution that is available. Please call or email us to discuss you specific requirements or click below to further explore our capabilities.